What is Surface Mount Technology?
Printed Circuit Boards (PCBs) historically were manufactured using through-hole technology (THT), where the leads for the component physically go through the board and are soldered to the opposite side.
SMT refers to the method of soldering components directly onto the surface.
Each component will have a corresponding set of landing pads on the PCB that fit the package dimensions. Solder paste gets applied to the pads via an automated process (using a screen printer or jet printer) and the components get placed into the solder.
When all components have been mounted, the board goes through a reflow oven. The soldering of the components happens when the oven reaches hot enough temperatures (around 230°C) to turn the paste into a liquid. As it cools, the joint is formed.
Benefits of Surface Mount Technology
There are many advantages to SMT which make it a popular choice for hardware designers, engineers, and contract manufacturers alike.
Automated Assembly
–Pick and place equipment can populate both sides of a board in minutes, even when there are hundreds of components involved. This leads to increased efficiency and accuracy.
Size
–Component sizes continue to decrease over time. This allows for more components to be placed in a tighter area.
Accuracy
–Machines have placement accuracy of 22 μm on a QFP to 46 μm @ 3 sigma. A micron is 1/1000th of a millimeter!
Cost Savings
–The increased efficiency and higher volumes capable often leads to quicker lead times and lower costs.

Capabilities You Can Count On
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Automatic surface mount assembly capabilities for accurate placement
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Fine pitch and BGA placement capabilities
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Wide range of base materials available including glass epoxy, ceramic, alumina (96% AL203), Aluminum nitrate (AIN), and flex
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Single or double-sided assemblies
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Full turn key available
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Selection of conformal coatings available
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Full layout and design capabilities to customer’ print
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Manufacturing from prototype quantities through production volume
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Assembled, inspected, and tested to MIL-STD and IPC specifications
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Electrical and environmental testing available
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RoHs assembly available
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Upgrade Your Old Technology
New designs commonly use both surface mount and through-hole technologies, rather than relying 100% on either one. Often it makes the most sense to combine the strengths of each technology in one design.
The passive components are surface mount, utilizing the space-saving properties. They can be placed strategically on either side of the board, optimizing the layout for placement and functionality of the device.
Through-hole components are the ones subjected to the most mechanical force. This includes things such as connectors, switches, power and ethernet ports, etc. Any component that has a direct interface with the user would benefit from the added mechanical strength of a through-hole connection.
A thorough review of your product’s design for manufacturing (DFM) can uncover the potential for cost savings and increased performance!
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