When design parameters cannot be met by traditional assembly techniques, Chip On Board (COB) could be the solution. Chip On Board is an excellent choice for miniaturizing your electrical circuit.
An unpackaged integrated circuit (IC) is mounted to a laminate substrate along with signal conditioning or support circuitry. Electrical connections are formed when the IC is attached to the corresponding substrate interconnects with gold wire bonding. A junction coating material can then be applied on top of the die to protect the die and wire bonds.
Chip on Board’s primary advantage is that it reduces the weight and mass of the circuit. When this is a primary concern, Chip On Board technology is your circuit miniaturization solution.