MCM has the same basic construction as COB but with some significant differences. Adding multiple integrated circuits allows us to combine more circuit functions into one multichip module, which further reduces circuit size and mass.
Ceramic substrate construction also provides superior thermal heat dissipation capability in harsh environments, making MCM an excellent choice for many industrial applications.
The MCM footprint is much smaller than conventional single chip packages. The smaller motherboard, and potentially smaller space requirements for panels, enclosure, and cabling result in a high-density module that resembles a single component when mounted on your printed circuit board.