Comparison Chart
| Multichip Module | Thick film Hybrid | Chip-on-Board | Surface Mount | Through Hole | |
|---|---|---|---|---|---|
| Description | Utilizes multiple unpackaged die on a single, multi-layer laminate or ceramic substrate. | Utilizes thick film technology on ceramic substrate. Component attachment may be surface mount or die and wire. May utilize printed resistors. | Utilizes die and wire technology on rigid or flex laminate substrate | Utilizes surface mount technology on rigid or flex laminate substrate | Utilizes through hole technology on rigid or flex laminate printed circuit board (PCB) |
| Base Material | Alumina (AL2O3), Aluminum Nitride (AIN). Beryllia (BeO) Glass Epoxy Polyimide-Kevlar Laminate sheets Flex | Alumina (AL2O3), Aluminum Nitride (AIN), Beryllia (BeO) | Glass-Epoxy Polyimide-Kevlar Laminate sheets Flex | Glass Epoxy Polyimide-Kevlar Laminate sheets Flex | Glass-Epoxy Polyimide-Kevlar Laminate sheets Flex |
| Conductors | Gold (Au) Palladium Gold (PdAu) Platinum (Pt Silver (Ag Palladium Silver (PdAg) Copper (Cu) | Gold (Au) Palladium Gold (PdAu) Platinum (Pt) Silver (Ag) Palladium Silver (PdAg) | Copper (Cu) with Gold plated pads | Copper (Cu) | Copper (Cu) |
| Resistors | Surface mount packages Cermet screened on resistive material | Surface mount packages Cermet screened on resistive material | Surface mount packages | Surface mount packages | Through hole packages |
| Processes | Sequence: Print, Dry, Fire (conductor, dielectric, resistor pastes) Automated surface mount component placement Reflow solder Die Attach Wire bonding | Sequence: Print, Dry, Fire (conductor, dielectric, resistor pastes) Automated surface mount component placement Reflow solder Die Attach Wire bonding | Sequence: Screen solder paste Automated surface mount component placement Reflow solder Die Attach Wire bonding | Sequence: Screen solder paste Automated surface mount component placement Reflow solder | Sequence: Through hole insertion Wave Solder |
Which technology is right for you?
Use the comparison chart.
SURFACE MOUNT
SURFACE MOUNT
SMT provides excellent space utilization and a very high degree of circuit reliability.
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THROUGH-HOLE PCB
THROUGH-HOLE PCB
Our through-hole PCB assembly procedure can handle both leaded and lead-free (RoHs) applications.
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HYBRID THICK FILM
HYBRID THICK FILM
A Hybrid circuit performs all or part of an electronic function by combining and interconnecting...
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CHIP ON-BOARD
CHIP ON-BOARD
When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB)...
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MULTI-CHIP MODULE
MULTI-CHIP MODULE
MCM has the same basic construction as Chip-On-Board but with some significant differences.
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BOX BUILD ASSEMBLY
BOX BUILD ASSEMBLY
Box build assembly consists of all the remaining assembly processes required to integrate...
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LINKS
CONTACT US
103 Grant Street
Aurora, NE 68818
Phone: 402-694-6111
Toll-Free: 800-260-6287
Fax: 402-694-6180