Hybrid Circuits – Thick Film Assembly

Hybrid circuits perform all or part of an electronic function by combining and interconnecting several passive and active semiconductor devices into a single package.

Aurora Boardworks’ hybrid circuits provide superior circuit density, performance, and reliability, with relatively low development and tooling costs. Aurora Boardworks provides over 45 years of experience in the design and manufacture of thick-film hybrid products for high-reliability application in the industrial, medical, and military markets. Aurora Boardworks provides the complete solution to your manufacturing problems including everything from initial layout design to final testing and inspection.

There are a variety of options for base materials of thick film substrates depending on the customer’s specific needs, such as Alumina (AL203), Aluminum nitride (AIN) or Beryllia (BeO). The selected substrate will be screen-printed with the conductor pattern and thick film resistors. Screen-printed resistors provide numerous benefits, including better tracking, improved interconnect reliability and package design flexibility through size reduction. The printed paste is then fired in tightly monitored temperature controlled, multi-zoned furnaces, binding the paste to the base material and becoming an integral part of the hybrid circuit. Passive and active semiconductor packages are then re-flowed onto the printed substrate. Bare die are attached to the substrate with epoxy and interconnected with gold wire bonds. A variety of lids or coatings may be applied to protect the die and wire bonds.